▎ 摘　　要

NOVELTY - A component carrier comprises stack comprising at least one electroconductive layer structure (104) and/or at least one electrically insulating layer structure (106). At least a portion of at least one electrically insulating layer structure comprises material (108) having a curing shrinkage value of less than 2%. USE - Component carrier e.g. laminate-type component carrier, printed circuit board, substrate (all claimed), organic interposer and integrated circuit substrate. ADVANTAGE - The component carrier has a low tendency of warpage. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of the component carrier, which involves providing a stack comprising at least one electroconductive layer structure and/or at least one electrically insulating layer structure, and providing at least a portion of the at least one electrically insulating layer structure of a material having a curing shrinkage value of less than 2%. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the component carrier. Laminate-type component carrier (100) Laminated stack (102) Electroconductive layer structure (104) Electrically insulating layer structures (106) Material (108)