• 专利标题:   Transferring graphene wafer comprises e.g. providing graphene wafer with metal substrate, using electrochemical bubbling process to peeling graphene wafer from metal substrate, and bubbling system in electrochemical bubbling process.
  • 专利号:   CN111232964-A
  • 发明人:   PENG H, LIU Z, YAN R, TANG J, DU Y
  • 专利权人:   BEIJING GRAPHENE INST
  • 国际专利分类:   C01B032/194
  • 专利详细信息:   CN111232964-A 05 Jun 2020 C01B-032/194 202052 Pages: 15 Chinese
  • 申请详细信息:   CN111232964-A CN10061392 19 Jan 2020
  • 优先权号:   CN10061392

▎ 摘  要

NOVELTY - Transferring graphene wafer comprises providing graphene wafer with metal substrate, using electrochemical bubbling process to peeling graphene wafer from the metal substrate, the bubbling system in the electrochemical bubbling process includes an aqueous phase and an organic phase, and the aqueous phase includes an aqueous electrolyte solution, and locating organic phase below aqueous phase. USE - The method is useful for transferring graphene wafer. ADVANTAGE - The method: reduces damage of graphene film during transfer process, and improves quality of graphene film. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) bubbling system using in electrochemical bubbling process comprising an aqueous phase and an organic phase, the aqueous phase includes an aqueous electrolyte solution, the organic phase is locating below aqueous phase, the organic phase includes a non-polar solvent having a density greater than that of water; and (2) graphene wafer.