• 专利标题:   High heat conduction LED lamp substrate, has substrate main body covered with aluminum and copper and coated with graphene mixture, and copper foil fixed with welding plate that welds electronic element.
  • 专利号:   CN107084321-A
  • 发明人:   QIN G, FANG J, CAI C, DONG X
  • 专利权人:   ANHUI KEFA INFORMATION SCI TECHNOLOGY
  • 国际专利分类:   F21K009/20, F21V023/00, F21V029/508, F21V029/83, F21V029/87, F21V029/89, F21Y115/10
  • 专利详细信息:   CN107084321-A 22 Aug 2017 F21K-009/20 201770 Pages: 5 Chinese
  • 申请详细信息:   CN107084321-A CN10316519 08 May 2017
  • 优先权号:   CN10316519

▎ 摘  要

NOVELTY - The substrate has a substrate main body covered with aluminum and copper and coated with graphene mixture, where mass ratio of copper and aluminum is about 1: 1 and thickness of the substrate main body is about 0.5-1.5 mm. The substrate main body is formed with a transverse small hole. The graphene mixture is made of epoxy resin that is adhered on a copper foil. The copper foil is fixed with a welding plate that welds an electronic element. The copper foil is coated with copper antioxidant to protect a surface of the copper foil. A pad part is formed with a through hole. USE - High heat conduction LED lamp substrate. ADVANTAGE - The substrate main body is provided with a transverse through hole and an upper through hole, so that heat radiation speed is improved. The substrate is inexpensive, and better heat conductivity and high heat dissipation rate. DESCRIPTION OF DRAWING(S) - The drawing shows a side perspective view of a high heat conduction LED lamp substrate.