▎ 摘　　要

NOVELTY - High-performance heat conducting material comprises 33-45 pts. wt. silicone resin, 30-46 pts. wt. hexagonal boron nitride, 10-18 pts. wt. alumina, 1-7 pts. wt. graphene, 0.1-1 pt. wt. platinum catalyst, 1-2 pts. wt. 0.5-0.8% hydrogen-containing silicone oil, 10-22 pts. wt. silane coupling agent, 1-5 pts. wt. organosiloxane surface modifier, 1-4 pts. wt. organosilicon silicone oil and 5-9 pts. wt. antioxidant 168. USE - High-performance heat conducting material used for improving LED's thermal transfer and heat radiation efficiency (claimed). ADVANTAGE - The heat conducting material is inexpensive, and has low surface tension, small viscosity-temperature coefficient and high compressibility and gas permeability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the preparation of high-performance heat conducting material comprising taking hexagonal boron nitride and organosiloxane surface modifier and stirring at 180-200 degrees C to obtain component A; taking alumina and half of silane coupling agent, stirring at 1000-1200 revolutions/minute (rpm) for 5-10 minutes, adding component A, stirring at 200-210 degrees C for 5 minutes, adding organosilicon silicone oil and stirring for 5 minutes to obtain component B; and taking graphene, vacuum drying at 0.06 MPa for 5 minutes, adding remaining silane coupling agent, stirring at 800-1000 rpm, adding silicone resin, platinum catalyst, hydrogen-containing silicone oil and antioxidant 168, stirring at 200-220 degrees C and 600-800 rpm for 10 minutes, cooling to 90-100 degrees C and double-screw extruding at 400-600 rpm.