▎ 摘　　要

NOVELTY - Conductive shielding tape comprises a base layer (1), an undercoat layer (2) and a conductive adhesive layer (3). The function of the primer layer is to connect the base material layer and the conductive adhesive layer. The base material layer includes polypropylene film, polyethylene film, polyethylene terephthalate film and polyvinyl chloride film. The primer is K-500 primer product is produced by 3M company in the United States. The conductive adhesive layer comprises 60-80 pts. wt. acrylate monomer, 10-30 pts. wt. aminated modified carbon-based conductive agent, 5-10 pts. wt. dilution solvent, and 0.1- 1 pts. wt. initiator. USE - The conductive shielding tape is useful for electromagnetic shielding. ADVANTAGE - The conductive shielding tape: ensures excellent conductivity, on the functional basis of electromagnetic shielding; has good compatibility with macromolecule resin; avoids the problem of bad compatibility and dispersibility caused by using single filler, mechanical property is reduced; is easy to generate agglomeration; has good conductivity, excellent mechanical property, and conductive filler does not agglomerate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing conductive shielding tape comprising (1) using the printing roller to coat the K500 bottom glue on the surface of the base material layer, online baking for 3-10 minutes at 80- 120C to obtain the base material layer with bottom glue, (2) adding 60-80 pts. wt. acrylate monomer, 10-30 pts. wt. amino modified carbon-based conductive agent, 5-10 pts. wt. diluting solvent in reaction kettle temperature 75degreesC, stirring for 3 minutes, stirring at the speed of 40-80 rotations/minute, adding 0.1-1 pts. wt. initiator, raising the temperature to 80 degrees Celsius to react for 1 hour, cooling to room temperature and stirring for 15 -25minutes, ultrasonically dispersing for 1 hour to obtain the conductive adhesive, and (3) uniformly coating the conductive adhesive on the substrate bottom rubber surface with bottom glue, online baking for 3-10 minutes at 80-120degreesC, forming semi-solid conductive adhesive layer on the bottom rubber layer to obtain the conductive shielding tape. DESCRIPTION OF DRAWING(S) - The drawing shows the structure schematic diagram of a conductive shielding adhesive tape. Base layer (1) Undercoat layer (2) Conductive adhesive layer (3)