▎ 摘　　要

NOVELTY - Method for preparing an organic resin composite material with 3D polyimide as a thermally conductive skeleton involves mixing aromatic diamine, aromatic dianhydride and organic solvent to perform polymerization reaction to obtain a polyamic acid solution, depositing the polyamic acid solution in a polar solvent, and sequentially pulverizing and drying the obtained deposit to obtain polyamic acid powder, mixing the polyamic acid powder, triethylamine, thermally conductive filler and water, and sequentially freezing and freeze-drying the obtained dispersion to obtain a polyamic acid aerogel, thermally curing the polyamic acid aerogel to obtain a thermally conductive filler-polyimide aerogel, mixing the thermally conductive filler-polyimide aerogel with an organic resin, and sequentially performing vacuum degassing and curing to obtain the product. USE - Method used for preparing organic resin composite material with 3D polyimide as thermally conductive skeleton (claimed), used in microelectronics and electronic components. ADVANTAGE - The method is beneficial to the distribution of the thermally conductive filler in a specific space, and has excellent thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an organic resin composite material with 3D polyimide as a thermally conductive skeleton prepared by the above-mentioned method comprising an organic resin matrix and a 3D polyimide thermally conductive skeleton distributed in the organic resin matrix, where the 3D polyimide thermally conductive skeleton comprises 3D polyimide and a thermally conductive filler supported on the 3D polyimide, the thermally conductive filler is uniformly distributed on the 3D polyimide to form a thermally conductive network.