• 专利标题:   Connection arrangement used in component carrier comprises stack for forming component carrier structure, comprises first electrically conductive connection element, and second electrically conductive connection element.
  • 专利号:   US2021074662-A1, EP3793336-A1, CN112563788-A, US11658142-B2
  • 发明人:   MOITZI H, STAHR J, ZLUC A, MOIZY H
  • 专利权人:   AT S AUSTRIA TECHNOLOGIE SYSTEMTECHN, AT S AUSTRIA TECHNOLOGIE SYSTEMTECHN, AT S AUSTRIA TECHNOLOGIES SYSTEM TEC, AT S AUSTRIA TECHNOLOGIES SYSTEM TEC
  • 国际专利分类:   H01L021/48, H01L023/00, H01L023/498, H05K001/11, H05K001/18, H05K003/34, H01L021/60, H01L023/48, H05K003/30, H05K003/36, H01R013/04, H01R013/10, H01R013/639, H01L021/00
  • 专利详细信息:   US2021074662-A1 11 Mar 2021 H01L-023/00 202135 English
  • 申请详细信息:   US2021074662-A1 US947786 17 Aug 2020
  • 优先权号:   EP196363

▎ 摘  要

NOVELTY - Connection arrangement comprises first electrically conductive connection element, and second electrically conductive connection element, where the first connection element and second connection element are configured such that, upon connecting the first connection element with the second connection element along a connection direction. A form fit is established between the first connection element and the second connection element that limits a relative motion between the first connection element and the second connection element in a plane perpendicular to the connection direction. The connection arrangement further comprises a third connection element arranged in the connection direction between the first connection element and second connection element for accomplishing a form fit both between the first and third connection elements and between the second and third connection elements. USE - Connection arrangement used in component carrier comprises stack for forming component carrier structure. ADVANTAGE - The connection arrangement allows to achieve enhanced and high package densities, and presence of form fit enables more accurate soldering, has increased resistance of current-carrying conductors at high frequencies. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: component carrier comprises stack including electrically conductive layer structure and/or electrically insulating layer structure; and a connection arrangement in and/or on the stack; and#method of forming a component carrier structure, involves providing a first electrically conductive connection element and a second electrically conductive connection element; connecting the first electrically conductive connection element with the second electrically conductive connection element along a connection direction in such a way that a form fit is established between the first connection element and the second connection element that limits motion of the first connection element and the second connection element relative to each other in a plane perpendicular to the connection direction. DESCRIPTION OF DRAWING(S) - The drawing shows a longitudinal sectional view of a connection arrangement. first electrically conductive connection element (1) econd electrically conductive connection element (2) third connection element (3) Stack (6) Concave Connection Surface (22)