• 专利标题:   Processing graphene thin film comprises e.g. carrying out spin-coating of adhesive layer onto the graphene thin film, placing transmission electron microscopy copper mesh on the electrostatic adsorption film, drying, soaking and locating.
  • 专利号:   CN104817073-A, CN104817073-B
  • 发明人:   LV P, WANG G, YANG Q, ZHANG Z
  • 专利权人:   UNIV CHINA SCI TECHNOLOGY, UNIV CHINA SCI TECHNOLOGY
  • 国际专利分类:   C01B031/04
  • 专利详细信息:   CN104817073-A 05 Aug 2015 C01B-031/04 201572 Pages: 10 Chinese
  • 申请详细信息:   CN104817073-A CN10145260 27 Mar 2015
  • 优先权号:   CN10145260

▎ 摘  要

NOVELTY - Processing graphene thin film comprises e.g. (i) carrying out spin-coating of an adhesive layer onto the graphene thin film, so that the adhesive layer faces upwards when suspended in deionized water; (ii) placing transmission electron microscopy (TEM) copper mesh on the electrostatic adsorption film; (iii) using forceps the step (ii) film is extends into step (i) deionized water, placing the mesh upwards, and covering top to bottom of the TEM copper mesh; (iv) drying, and soaking; and (iv) locating resultant composite structures on the graphene film using forceps. USE - The method is useful for processing graphene thin film (claimed). ADVANTAGE - The film avoids age in their structures, makes easy to gripe and easy to transfer thin film. The method is easy to operate. DETAILED DESCRIPTION - Preparing graphene thin film comprises step (i) carrying out spin-coating of an adhesive layer onto the graphene thin film, so that the adhesive layer faces upwards when suspended in deionized water; (ii) placing transmission electron microscopy (TEM) copper mesh on the electrostatic adsorption film, where area of the electrostatic adsorption membrane is at least four times of the TEM copper mesh area, and the electrostatic adsorption film area is not less than step (i) area of the graphene film; (iii) using forceps the step (ii) electrostatic adsorption film is extends into step (i) deionized water and placing the TEM copper mesh upwards and removing graphene film, and covering top to bottom of the TEM copper mesh to obtain protective adhesive layer/graphene film/TEM copper mesh/electrostatic adsorption film composite structure; (iv) naturally drying protective adhesive layer/graphene film/TEM copper mesh/electrostatic adsorption film complex structure and soaking in acetone to remove the protective adhesive layer to obtain graphene film/TEM copper mesh/electrostatic adsorption film composite structure; and (iv) locating graphene film/TEM copper mesh/electrostatic adsorption film composite structure on the graphene film using forceps and removing film from electrostatic adsorption film to obtain final product transferred onto TEM copper network.