• 专利标题:   Agent useful for treating surface of metal material e.g. copper, comprises specified weight ratio of silane-modified filler containing anionic functional groups, polysiloxane polymer, fluorine-containing compound, vanadium compound and silicon modified polyurethane with polysiloxane structure.
  • 专利号:   CN115975492-A
  • 发明人:   LI Y, JI W, LI W
  • 专利权人:   PARKER SURFACE TECHNOLOGIES SHANGHAI CO LTD
  • 国际专利分类:   C09D163/00, C09D175/04, C09D007/61, C09D007/62
  • 专利详细信息:   CN115975492-A 18 Apr 2023 C09D-175/04 202342 Chinese
  • 申请详细信息:   CN115975492-A CN10058652 16 Jan 2023
  • 优先权号:   CN10058652

▎ 摘  要

NOVELTY - A metal material surface treatment agent comprises 8.0-67.0 wt.% silane-modified filler containing anionic functional groups, 5.0-48.0 wt.% polysiloxane polymer, 0.3-5.0 wt.% a fluorine-containing compound, 0.4-9.0 wt.% a vanadium compound and 19.0-85.0 wt.% a silicon modified polyurethane (F) with polysiloxane structure. USE - Agent useful for treating a surface of a metal material such as copper, copper alloy, aluminum, aluminum alloy or stainless steel (claimed). ADVANTAGE - The metal material surface treatment agent is coated on the surface of the metal material to give high heat resistance and high thermal conductivity resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a preparation method of the metal material surface treatment agent, which involves: adding silane containing anionic functional groups to water or a mixture of water and an organic solvent to modify the permanent filler, and uniformly mixing polysiloxane polymer, fluorine-containing compound, vanadium compound and silicon-modified polyurethane, where the organic solvent is miscible with water, and the content of water in the mixture of water and organic solvent is not less than 25 wt.%; and (2) a metal material surface treatment method, which involves coating the metal material surface treatment agent on a metal material surface, forming a film after drying, and controlling the film forming temperature at 60-200° C.