▎ 摘　　要

NOVELTY - The device has a heat guide piece (1) fixed with a semiconductor refrigerating sheet (2) that is provided with a cold end part (21) and a hot end part (22). The heat guide piece is connected between a CPU chip and a side surface. The semiconductor refrigerating sheet is arranged with an N-type semiconductor and a P-type semiconductor. The semiconductor refrigerating sheet, the N-type semiconductor and the P-type semiconductor are fixed with a graphene layer. A side part of the hot end part is fixed with a heat abstractor device (3). USE - CPU radiating device. ADVANTAGE - The device avoids heat abstractor device to avoid burning of a semiconductor refrigerating device to ensure normal working operation in an effective manner. DETAILED DESCRIPTION - The heat guide piece is a graphite heat guide piece. DESCRIPTION OF DRAWING(S) - The drawing shows a front view of a CPU radiating device. Heat guide piece (1) Semiconductor refrigerating sheet (2) Heat abstractor device (3) Cold end part (21) Hot end part (22)