▎ 摘　　要

NOVELTY - Epoxy resin comprises 30-50 pts. wt. hydroxystyrene/styrene copolymer, 20-30 pts. wt. halogenated alcohol, 10-15 pts. wt. amino silicone oil, 15-25 pts. wt. curing agent, 10-20 pts. wt. alkali solution and 5-10 pts. wt. dielectric filler. USE - The epoxy resin is useful in flexible circuit boards. ADVANTAGE - The epoxy resin has improved dielectric properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for (1) preparing epoxy resin comprising taking hydroxystyrene/styrene copolymer, halogenated alcohol, amino silicone oil, curing agent, alkali solution and dielectric filler, uniformly mixing hydroxystyrene/styrene copolymer, halogenated alcohol and amino silicone oil, adding a catalyst, heating to 40-80 degrees C to perform etherification reaction to obtain a first reactant, uniformly stirring alkali solution and dielectric filler, naturally oxidizing in atmosphere to obtain second reactant, uniformly mixing first reactant and the second reactant, washing with water to remove salt and adding curing agent for curing to obtain epoxy resin; (2) device for preparing epoxy resin comprising configuration module, etherification reaction module, natural oxidation module and curing module; and (3) computer-readable storage medium comprising a set of instructions for preparing epoxy resin.