• 专利标题:   Method for manufacturing semiconductor device, involves forming graphene layer on first epitaxial layer, and forming second epitaxial layer comprising predetermined semiconductor material on graphene layer.
  • 专利号:   WO2018089444-A1, KR2019073558-A, CN110050335-A
  • 发明人:   KIM J, LEE K
  • 专利权人:   MASSACHUSETTS INST TECHNOLOGY
  • 国际专利分类:   H01L021/306, H01L021/683, H01L021/02, H01L021/67, H01L021/762, H01L021/78, H01L029/16
  • 专利详细信息:   WO2018089444-A1 17 May 2018 H01L-021/683 201835 Pages: 30 English
  • 申请详细信息:   WO2018089444-A1 WOUS060568 08 Nov 2017
  • 优先权号:   US418964P, CN80075423

▎ 摘  要

NOVELTY - The method involves forming a first epitaxial layer (120) on a first substrate, where the first substrate (110) comprises a first semiconductor material with a first lattice constant and the first epitaxial layer comprising a second semiconductor material with a second lattice constant different from the first lattice constant. A graphene layer (130) is formed on the first epitaxial layer. A second epitaxial layer (140) comprising the second semiconductor material is formed on the graphene layer. The graphene layer is formed on a second substrate. USE - Method for manufacturing a semiconductor device. Uses include but are not limited to solar cell, photodetector, transistor and LED. ADVANTAGE - The method enables releasing epi-layers grown on a graphene substrate easily and precisely released from the substrate, thus allowing rapid mechanical release of epilayers without post-release reconditioning of a released surface. The method enables reducing manufacturing costs by performing a minimal substrate refurbishment step after layer release and performing precise control of release thickness. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a semiconductor device formed with a two-dimensional (2D) material layer for dislocation filtering. Substrate (110) Epitaxial layers (120, 140) Graphene layer (130) Device structure (150)