▎ 摘　　要

NOVELTY - Preparing heat conducting electronic potting adhesive comprises (a) adding terminal disiloxane monomer to an ethanol solution containing deionized water under a nitrogen atmosphere, stirring for 30 minutes, hydrolyzing, reacting at 55degrees Celsius for 4 hours, vacuum distilling, drying, filtering to obtain the hyperbranched polysiloxane, (b) uniformly stirring vinyl polydimethylsiloxane and the hyperbranched polysiloxane at 40-55degrees Celsius, adding modified radiating filler, transferring to a vacuum kneading machine, kneading, discharging to obtain a base material, (c) adding hydrogen-containing silicone oil to the base material, stirring to obtain component A, (d) adding the platinum catalyst to the base material, stirring evenly to obtain component B and (e) uniformly mixing A component and the B component and defoaming at 0.07 MPa for 10 minutes to obtain a heat conducting electronic potting adhesive. USE - The method is useful for preparing heat conducting electronic potting adhesive ADVANTAGE - The method reduces the increase of the modified radiating filler increases the viscosity of the potting sealant system; grafts 2-(6-Oxido-6H-dibenz(c,e)(1,2)oxaphosphorin-6-yl)-1,4-benzenediol on the heat dissipation network and improves the flame retardant performance of the potting adhesive DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a heat conducting electronic potting adhesive prepared by the above method.