• 专利标题:   Semiconductor device has graphene layers which include multiple graphemes laminated perpendicularly with respect to the corresponding side surfaces of core of wiring.
  • 专利号:   US2013056873-A1, US8482126-B2
  • 发明人:   WADA M, YAMAZAKI Y, KAJITA A, SAKATA A
  • 专利权人:   TOSHIBA KK
  • 国际专利分类:   H01L023/532, H01L023/48, H01L023/52
  • 专利详细信息:   US2013056873-A1 07 Mar 2013 H01L-023/532 201319 Pages: 15 English
  • 申请详细信息:   US2013056873-A1 US224929 02 Sep 2011
  • 优先权号:   US224929

▎ 摘  要

NOVELTY - The semiconductor device has first and second graphene layers (14) individually formed on the side surfaces of the core (11) of a wiring (10). The graphene layers respectively contact first and second catalyst layers (13) and extend along the length direction of the core. The graphene layers include multiple graphemes laminated perpendicularly with respect to the corresponding side surfaces of the core. USE - Semiconductor device. ADVANTAGE - Enables increasing the width of the graphene layer to increase the number of hexagonal lattices in the width direction of the graphene layer without increasing the width of the wiring, thus suppressing an increase in wiring resistance attributable to an edge effect and a miniature wiring structure with low resistance can be obtained. DESCRIPTION OF DRAWING(S) - The drawing shows the perspective view of a semiconductor device. Contact plug (6) Wiring (10) Core (11) Catalyst layers (13) Graphene layers (14)