▎ 摘　　要

NOVELTY - The sensor has sound collecting cavities processed with through-hole plates (7, 8) that are uniformly distributed on sound-pickup cavities (11, 12). A bottom surface of a rectangular frame is provided with an upper metal layer (3) bonded with a lower metal layer (4). The lower metal layer is bonded on a lower structure layer (2). Sides of the lower structure layer and an upper structure layer (1) are provided with upper layer and lower layer metal bonding pads. A graphene layer is clamped between lower insulation layers. A graphite pad is connected to upper insulating layers. USE - Microelectromechanical system (MEMS) acoustic sensor. ADVANTAGE - The sensor has high sensitivity and resolution, excellent mechanical characteristics and electrical characteristics, and is accurate, precise and reliable. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a microelectromechanical system acoustic sensor. Upper structure layer (1) Lower structure layer (2) Upper metal layer (3) Lower metal layer (4) Through-hole plates (7, 8) Sound-pickup cavities (11, 12)