• 专利标题:   Palladium-silver-copper alloy wire rod for use in wafer testing, comprises palladium, silver, graphene copper, indium and unavoidable impurities.
  • 专利号:   TW797023-B1
  • 发明人:   CHUANG Y H, QIU L, CHAO C Y
  • 专利权人:   TA YA ELECTRIC WIRE CABLE CO LTD
  • 国际专利分类:   B21C001/00, C22C030/02, C22F001/00, G01R001/067, H01L021/66
  • 专利详细信息:   TW797023-B1 21 Mar 2023 C22C-030/02 202339 Pages: 23 Chinese
  • 申请详细信息:   TW797023-B1 TW122041 14 Jun 2022
  • 优先权号:   TW122041

▎ 摘  要

NOVELTY - The present invention provides a palladium-silver-copper alloy wire rod, which comprises palladium, silver, graphene copper, indium and inevitable impurities, wherein, based on the total weight of the palladium-silver-copper alloy wire rod, the content of palladium is 45 wt% to 50 wt%, the content of silver is 25 wt% to 30 wt%, the content of graphene copper is 22 wt% to 29.5 wt%, and the content of indium and unavoidable impurities is 0.4 wt% to 0.6 wt%. Based on the total weight of the graphene copper, the graphene content in the graphene copper is greater than or equal to 100 ppm and less than or equal to 350 ppm. Since the palladium-silver-copper alloy wire rod of the present invention contains a specific composition in a specific content, the probe made of it further has excellent wear resistance, and further application in wafer testing can effectively reduce the detection defect rate.