▎ 摘　　要

NOVELTY - Low-expansion coefficient halogen-free resin composition, comprises (a) 1-10 pts. wt. o-cresol epoxy resin, (b) 50-70 pts. wt. bismaleimide resin, (c) 30-45 pts. wt. polyvalent hydroxy-modified styrene resin, (d) 60-90 pts. wt. cyanate ester hardener, and (e) 1-20 pts. wt. non-9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide phosphorus-containing flame retardant. USE - The composition is useful in laminate and printed circuit board (all claimed). ADVANTAGE - The halogen-free resin composition has low expansion coefficient, low dielectric loss and high rigidity, and provides better toughness and heat resistance to the laminated plate and printed circuit board. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: Laminate, comprising resin substrate including plurality of prepreg sheets, and each of the prepreg sheets is made of a glass fiber cloth coated with halogen-free resin composition having low coefficient of expansion, and metal foil layer is disposed on at least one surface of the resin substrate; and Printed circuit board, comprising laminate.