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  • 专利标题:   Formation of complex plating film used in electronic material, involves adding graphene-coated metal powder to plating solution, and forming plating film by performing electric plating in solution to which metal powder is added.
  • 专利号:   US2016024681-A1, US9850592-B2
  • 发明人:   SUH S, SONG Y, PARK J, KIM T, SON H, SHIN J, LEE M, LEE J, LEE C, CHO Y, BAEG S, AHN B, YUN S
  • 专利权人:   UNIV SUNGKYUNKWAN RES BUSINESS FOUND
  • 国际专利分类:   C25D015/00, C25D003/12, C25D003/20, C25D003/38, C25D003/46, C25D003/48, C25D003/54, B05B007/00, C25D003/44
  • 专利详细信息:   US2016024681-A1 28 Jan 2016 C25D-015/00 201612 Pages: 8 English
  • 申请详细信息:   US2016024681-A1 US804398 21 Jul 2015
  • 优先权号:   KR091838

▎ 摘　　要

NOVELTY - Formation of a complex plating film involves adding a multi-layer graphene-coated metal powder to a plating solution, and forming a plating film by performing electric plating in a plating solution to which the metal powder is added. USE - Formation of complex plating film (claimed) used in electronic materials. ADVANTAGE - The method enables formation of complex plating film having excellent electrical and mechanical properties.