▎ 摘　　要

NOVELTY - Method for preparing polyimide film involves (a) mixing the polyimide film substrate, thermally conductive filler, and solvent, and dispersing evenly to obtain a mixed dispersion, and (b) coating the mixed dispersion on the base material and synthesizing the polymer to obtain the polyimide film, where the polyimide film comprises 40-90 %mass polyimide film matrix, and 5-40 %mass heat-conducting filler, and remaining of a solvent. USE - Preparation of film polyimide used in micro-electronics, nano-liquid crystal, separating film, laser, microelectronic packaging field. ADVANTAGE - The method adds high heat-conducting inorganic filler in the polyimide, by constructing continuous micro-conductive heat path and reducing interface thermal resistance, improving the heat conducting performance of the material, and effectively solving the problem of bad heat conducting property of material itself. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a polyimide film prepared by the above-mentioned method.