• 专利标题:   Preparation of digital metal surface ceramic tile involves mixing chromium powder, aluminum powder and titanium powder, mixing with modified graphene, bonding to obtain composite body, spraying metal material, and irradiating.
  • 专利号:   CN114409439-A, CN114409439-B
  • 发明人:   LI J, ZENG Y, LU P, WANG L, YE J
  • 专利权人:   GUANGDONG OVERLAND CERAMICS CO LTD
  • 国际专利分类:   C04B041/90
  • 专利详细信息:   CN114409439-A 29 Apr 2022 C04B-041/90 202262 Chinese
  • 申请详细信息:   CN114409439-A CN10017909 08 Jan 2022
  • 优先权号:   CN10017909

▎ 摘  要

NOVELTY - The method comprises (i) placing ceramic tile in hydrochloric acid solution with concentration of 1-1.5mol/L to soak for 15-25 minutes, then using clean water to wash for 1-3 times, drying, (ii) mixing chromium (Cr) powder, aluminum powder and titanium powder according to weight ratio of 1: 2: 1 to obtain metal composite powder, mixing with 10-20 % modified graphene to obtain metal material, (iii) bonding to obtain composite body, (iv) spraying metal material at 1-2 g/second to obtain metal surface ceramic tile, (v) irradiating with UV lamp at irradiation lamp distance of 1-5 mm and irradiation power of 200-500 W for 5-10 seconds, performing thermal activation modification treatment, finally obtaining the digital metal surface ceramic tile. USE - Method for preparing digital metal surface ceramic tile. ADVANTAGE - The method is convenient for bentonite modification treatment, so as to graft the bentonite, to graft into the adhesive body, and to improve the application efficiency of the adhesive. The ceramic tile base body is firstly cleaned, improving the cleanliness of the ceramic tile. The metal material spraying the effect of the aggregate bonding in the preparation of bonding modifier. The bentonite is sent to the modified liquid to process. The modified liquid is mixed by trihydroxymethyl aminomethane and dopamine hydrochloride solution, and the added silane coupling agent maleic anhydride and so on. The method improves the adhesion strength of the metal material on the bonding improver.