• 专利标题:   Apparatus for electrochemical or electroplating etching of copper foils from graphene for e.g. electronic device application, has anode including metal substrate layer etched from graphene layer in response to current flowing through anode.
  • 专利号:   US2014076721-A1, US9045842-B2
  • 发明人:   HAN S, GUO L, LI X
  • 专利权人:   INT BUSINESS MACHINES CORP
  • 国际专利分类:   C25F007/00, B32B038/10, C01B031/04, C25F003/02, C25F005/00
  • 专利详细信息:   US2014076721-A1 20 Mar 2014 C25F-007/00 201423 Pages: 10 English
  • 申请详细信息:   US2014076721-A1 US617727 14 Sep 2012
  • 优先权号:   US617727

▎ 摘  要

NOVELTY - The apparatus (100) has a power supply (102) including a negative terminal (112) and a positive terminal (114). A container (104) contains an electrolyte (115). A cathode (108) is coupled to the container, and fluidly communicates with the electrolyte. The cathode includes a portion electrically connected to the negative terminal. An anode (110) is provided with a portion electrically connected to the positive terminal, and includes a graphene layer (118) and a metal substrate layer (120) that is etched from the graphene layer in response to the current flowing through the anode. USE - Apparatus for electrochemical or electroplating etching of metal substrates i.e. copper foils, from graphene for an electronic device application and a semiconductor application. ADVANTAGE - The graphene layer of the anode is electrically coupled to a metal plate and configured to receive current and maintain sustainably increased current throughput through a copper film such that overall etching time of the copper film can be reduced, so that large scale productions of graphene can be achieved. The current output from the power supply is kept low such that the current density does not reach a level that damages the graphene layer, thus preventing damage of the graphene layer. The apparatus provides a new-graphene layer to be formed on a new-metal substrate layer of the cathode such that the metal substrate layer can be recycled and composition of the electrolyte solution can be maintained, thus providing an environmentally-friendly solution for disposing the electrolyte solution. DETAILED DESCRIPTION - The metal substrate layer is made of copper. The electrolyte is a solution of sulfuric acid, a solution of copper chloride and electrolyte metal. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of an electrochemical or electroplating etching apparatus. Electrochemical or electroplating etching apparatus (100) Power supply (102) Container (104) Cathode (108) Anode (110) Negative terminal (112) Positive terminal (114) Electrolyte (115) Graphene layer (118) Metal substrate layer (120)