▎ 摘　　要

NOVELTY - Preparation of copper-clad plate comprises adding epoxy resin, filler and epoxy resin curing agent to reactor, adding organic solvent, constantly stirring, adding organic solvent until solid content reaches 60-80%, soaking fabric in glue A, taking out, placing into template, baking at 160-170degrees Celsius for 6-8 minutes to obtain surface shading layer, adding epoxy resin, filler and epoxy resin curing agent into reactor, mixing to obtain mixture, adding graphene to organic solvent, ultrasonically dispersing, adding mixture, stirring, adding curing accelerator, stirring, adding organic solvent to adjust solid content to 60-80%, to obtain glue B, adding fabric, soaking, taking out, placing into template, baking at 160-170degreesC for 6-8 minutes to obtain internal bonding sheet, installing surface shading layer symmetrically on both sides of internal bonding sheet, installing copper clad on at least one side of both sides of semi-finished copper clad laminate, and hot pressing. USE - The method is used for preparing copper-clad plate. ADVANTAGE - The method provides copper-clad plate with excellent light-shielding property, and improved market competitiveness. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for hot pressing device.