▎ 摘　　要

NOVELTY - A circuit board material comprises board material, adhesive and reinforcing material. The reinforcing material is made of polyester resin, glass fiber, asphalt-based carbon fiber, and nano-graphene. The board material is made of acrylonitrile butadiene styrene resin, phthalate, epoxy resin glue, polyphenylene sulfide, n-butyl alcohol, styrene-butadiene rubber, polyethylene wax, molybdenum trioxide, cocamide diethanolamine, PVC, polystyrene, isocyanate, methacrylate, N-methylenebisacrylamide, dimethyl trimethylsilylmethylphosphonate, methyl methacrylate, or isocyanate. USE - Circuit board material. ADVANTAGE - The lightweight circuit board material has high flexibility, toughness, strength and heat dissipation performance. DETAILED DESCRIPTION - The circuit board material is prepared by (1) weaving glass fiber, asphalt-based carbon fiber, and nano-graphene into mesh shape by a knitting apparatus, (2) coating polyester resin on a surface of the woven mesh reinforcing rib, (3) adding acrylonitrile butadiene styrene resin, phthalate, epoxy resin glue, polyphenylene sulfide, n-butyl alcohol, styrene-butadiene rubber, and polyethylene wax to a heating container, heating to dissolve at 230-250 degrees C, adding molybdenum trioxide, cocamide diethanolamine, PVC, polystyrene, isocyanate, methacrylate, N-methylenebisacrylamide, dimethyl trimethylsilylmethylphosphonate, methyl methacrylate, and isocyanate to a stirrer under heat-preservation state, and uniformly stirring in a form of sticky particles, (4) pressing the uniformly stirred particles before cooling into board with thickness of 0.5 mm by a press with force of 5 tons, cooling and forming, (5) placing the reinforced rib mesh in a middle of a supported plate, and coating the adhesive, and (6) pressing the plate with press at pressure of 15 tons, and maintaining for 30 minutes.