▎ 摘　　要

NOVELTY - Composition comprises fluorine-containing polymer containing a unit based on a fluoroolefin and a unit having a crosslinkable group, heat conductive filler and a curing agent. The content ratio of the heat conductive filler to the total mass of the fluorine-containing polymer and the heat conductive filler is 11-89 %mass. USE - The composition is used in a coating film which is used in a substrate for coating film, a heat exchanger, and plasma etching processing facility (claimed), as a heat dissipation/heat transfer resin material and a heat conductive film forming material, latter material, electric/electronic industry field and the automobile field, thermal power generation equipment, chimneys for discharging exhaust gas generated during combustion, exhaust pipes, as a material for forming a heat conductive film on a heat radiating component, heat-dissipating parts including power devices, transistors, thyristors, rectifiers, transformers, power MOSFETs, CPUs, heat-dissipating fins and metal heat-dissipating plates, personal computers and displays, electronic device materials, interior and exterior of automobiles, sealing materials such as processing machines, as a material for forming a heat conductive heat-resistant coating layer, printed wiring board, a thermal interface material, a substrate for a power module, a coil used in a power device such as a motor, sliding parts such as bearings, pistons, bearings, slide switches and gears, a separator of a fuel cell, for bonding electronic components such as integrated circuit (IC) chips, resistors, and capacitors mounted on boards in semiconductor elements, high-density boards, module parts, used for bonding ceramic parts and metal parts to each other in an in-vehicle engine, energizing elements in printed circuit boards, sensor electrodes, displays, backplanes, radio frequency identification (RFID), photovoltaic power generation, lighting, disposable electronic devices, automobile heaters, electromagnetic wave (EMI) shields, and membrane switches. ADVANTAGE - The composition suppresses heat loss, forms coating film with excellent adhesion, can be easily adjusted to an appropriate viscosity and does not require a high temperature for curing, and has excellent thermal conductivity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a coating film having a thermal conductivity of 0.3 W/mK or more or a volume resistivity of 1asterisk1010 Omega .cm or less, which is formed by the composition, or having a linear expansion coefficient of 200 ppm/ degrees C or less in a temperature range equal to or lower than the glass transition temperature of the fluorine-containing polymer, which is formed by the composition; (2) a substrate with a coating film having the above-mentioned coating film; (3) a heat exchanger comprising a heat transfer tube comprising the coated substrate; and (4) a plasma etching processing facility comprising the member comprising the coated substrate.