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  • 专利标题:   Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.
  • 专利号:   CN115895270-A
  • 发明人:   HE Y, LIU F, YU G
  • 专利权人:   CHANGSHA ADVANCED ELECTRONIC MATERIALS
  • 国际专利分类:   C08K003/04, C08K009/02, C08K009/06, C08L063/02, C08L083/07, C09K005/14, H05K007/20
  • 专利详细信息:   CN115895270-A 04 Apr 2023 C08L-083/07 202337 Chinese
  • 申请详细信息:   CN115895270-A CN11355519 01 Nov 2022
  • 优先权号:   CN11355519

▎ 摘　　要

NOVELTY - A heat-conducting gel comprises 20-40 pts. wt. silicone oil matrix, 10-20 pts. wt. epoxy resin E51 (bisphenol-A-type epoxy resin) and heat-conducting filler comprising 2-10 pts. wt. modified graphene, 2-10 pts. wt. modified diamond and 2-10 pts. wt. modified carbon nanotubes. The surface of the modified graphene is modified with amino group. The surface of the modified diamond is modified with amino group. The surface of the modified carbon nanotubes is modified with carboxyl group. USE - The heat-conducting gel is useful for heat dissipation of electronic device (claimed). ADVANTAGE - The gel has excellent heat-conducting performance. The crack that appears after long-term use can achieve self-healing. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the heat-conducting gel, which involves mixing the above-mentioned components.