• 专利标题:   LED light source packaging structure for preparing high power graphene, has substrate whose upper and lower surfaces are covered with single layer graphene material.
  • 专利号:   CN102412352-A
  • 发明人:   WANG Q, LOU M, GUO B
  • 专利权人:   HANGZHOU CREATE EPOCH PHOTOELECTRICITY T
  • 国际专利分类:   H01L033/00
  • 专利详细信息:   CN102412352-A 11 Apr 2012 H01L-033/00 201234 Pages: 7 Chinese
  • 申请详细信息:   CN102412352-A CN10355530 10 Nov 2011
  • 优先权号:   CN10355530

▎ 摘  要

NOVELTY - The structure has chip that is electrically connected with the substrate. The upper and lower surfaces of the substrate are covered with single layer graphene material. The metal layer is made of silver, copper or aluminum material. USE - LED light source packaging structure for preparing high power graphene. ADVANTAGE - The graphene can be prepared with high power speed through increasing area and weight of base plate, so that the LED light source can be provided with high power volume and wideability. The cost of the LED light source can be reduced. The physical properties of the graphene can be utilized fully. The high power LED light source chip generates the heat for radiating to the chip, without increasing the volume of light source, thus improving working temperature of the chip. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for method for manufacturing LED light source packaging structure. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of the LED light source packaging structure.