• 专利标题:   Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.
  • 专利号:   CN115403805-A
  • 发明人:   CAI C, YU F, LU M, CHEN J, HE H
  • 专利权人:   HUIZHOU ZHONGSHENG ELECTRONIC MATERIAL
  • 国际专利分类:   B29C065/74, B32B017/02, B32B017/12, B32B033/00, B32B037/06, B32B037/10, B32B038/00, C08G059/16, C08J005/24, C08K003/04, C08K003/22, C08K003/38, C08K007/14, C08K009/02, C08K009/06, C08L063/00, C08L063/10
  • 专利详细信息:   CN115403805-A 29 Nov 2022 C08J-005/24 202309 Chinese
  • 申请详细信息:   CN115403805-A CN10965238 12 Aug 2022
  • 优先权号:   CN10965238

▎ 摘  要

NOVELTY - Processing high-strength computer back cover with intermediate frame, involves cutting epoxy glass fiber board to obtain intermediate frame plate and cover plate, milling intermediate frame board out of mounting cavity to form intermediate frame, and welding intermediate frame and cover plate. USE - Processing technique of high strength computer back cover with middle frame used as main components for protecting computer body. Can also be used in mobile phone product. ADVANTAGE - The high strength computer rear cover with middle frame and processing technique. It has balance strength and toughness, at the same time, effectively improving the radiating performance. It can be effectively toughened, the optimized complementary is formed between the filler, to balance strength, and toughness and improve impact resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (A)high-strength computer rear cover prepared by processing technique of high-strength computer rear cover with middle frame, involves(1)mixing 10-12 pts.wt. vinyl epoxy resin, 18-22 pts.wt. mercapto filler and 50-60 pts.wt. solvent, adding 100 pts.wt. epoxy resin, uniformly mixing, adding 0.5-0.8 pts.wt. photoinitiator, 25-30 pts.wt. curing agent and 0.1-0.5pts.wt. curing accelerator, and homogenizing to obtain gum dipping solution;(2) cleaning glass fiber cloth, coating silica sol on two sides of the glass fiber cloth, and drying to obtain glass fiber cloth (A), coating gum dipping solution on two sides, and carrying out photocuring and thermocuring to obtain prepreg;(3)overlapping prepreg, and performing hot pressing to obtain epoxy glass fiber board. (B)The high-strength computer rear cover with middle frame which is prepared by the processing technology. DESCRIPTION OF DRAWING(S) - The drawing shows a block diagram of high strength computer back cover. 1Middle frame 2Covering a plate 3Installing a cavity