▎ 摘　　要

NOVELTY - Heat dissipation and electromagnetic wave shielding composite material comprises first insulating layer and second insulating layer facing each other and electromagnetic wave shielding layer disposed between first insulating layer and second insulating layer. Each of the first and second insulating layers includes a first dispersion matrix and a first filler dispersed in the first dispersion matrix and having a two-dimensional plate-like structure. The second insulating layer comprises a second dispersion matrix and a second filler dispersed in the second dispersion matrix and having two-dimensional hexagonal boron nitride particles and a conductive coating film covering the surface. USE - The heat dissipation and electromagnetic wave shielding composite material is useful in electronic device package. ADVANTAGE - The heat dissipation and electromagnetic wave shielding composite material has excellent insulation properties, has electromagnetic wave shielding characteristics to prevent malfunction of peripheral equipment and various electronic devices due to electromagnetic wave interference, and has high electrical conductivity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) electronic device package, comprising electronic devices. A mold capping the electronic device and above-mentioned heat dissipation and electromagnetic wave shielding composite material formed to cover at least a portion of the surface of the mold; and (2) manufacturing heat dissipation and electromagnetic wave shielding composite material, comprising forming a first insulating layer by applying a first composition including a first solvent, two-dimensional hexagonal boron nitride particles, and a first polymer matrix to the mold surface, forming an electromagnetic wave blocking layer by applying a second composition including a second solvent, boron nitride particles having a conductive coating film formed on the surface, and a second polymer matrix on the first insulating layer, and forming a second insulating layer by applying a third composition including a third solvent, two-dimensional hexagonal boron nitride particles and a third polymer matrix on the electromagnetic wave blocking layer.