▎ 摘　　要

NOVELTY - The present invention discloses a radiation heat dissipation structure, which includes a substrate and a heat radiation layer. The heat radiation layer is disposed on the substrate and contains graphene, ceramic powder, silicon dioxide, aluminum oxide and carbon black, and the thickness ratio of the heat radiation layer to the thermally conductive substrate is 1:2.5-800 . The radiant heat dissipation structure of this creation has excellent heat dissipation performance, can prevent local overheating, eliminate hot spots, and does not require additional heat dissipation devices in practical applications.