▎ 摘　　要

NOVELTY - Ultraviolet anti-adhesive tape comprises a first base material layer, a first adhesive layer and a second adhesive layer which are stacked in sequence. The first adhesive layer contains acrylic resin and curing agent. The second adhesive layer includes acrylic resin, curing agent and photoinitiator. The first adhesive layer and the second adhesive layer contain hydroxy groups, and the molar ratios of hydroxy groups and curing agent groups in the first adhesive layer and the second adhesive layer are not equal. The molar ratio of hydroxy groups and curing agent groups in the first adhesive layer is ≯ 1:1. The molar ratio of hydroxy groups and curing agent groups in the second adhesive layer is ≮ 1:1. The molar ratio of hydroxy groups and curing agent groups in the first adhesive layer is ≮ 1:1. The molar ratio of hydroxy groups to curing agent groups in the second adhesive layer is ≯ 1:1. USE - The ultraviolet anti-adhesive tape is useful for manufacturing semiconductor wafer for wafer grinding and cutting process. ADVANTAGE - The adhesive tape: solves problem that UV anti-adhesive tape is layered with the substrate layer in the using process; reduces damage condition of the wafer grinding process; realizes effect that the adhesive tape after grinding can be easily peeled after being irradiated by UV light.