▎ 摘 要
NOVELTY - Preparing continuous fiber-reinforced thermosetting resin-based composite material having high thermal conductivity, comprises (1) uniformly dispersing epoxy prepolymer, curing agent, catalyst, thermally conductive filler and solvent to obtain mixed solution, impregnating continuous fibers, removing the solvent by heating and cooling to obtain solvent-based prepreg; or uniformly dispersing epoxy prepolymer, curing agent, catalyst and thermally conductive filler under heating conditions to prepare a film, and then impregnating the continuous fiber with the film and cooling to obtain hot-melt prepreg, where the curing agent includes at least one curing agent having an aromatic amide structure, the epoxy prepolymer with aromatic amide structure is compound (I) or (II) or their mixture, (2) hot-pressing the above-mentioned solvent method prepreg or hot melt method prepreg and solidifying to obtain final product. USE - The method is useful for preparing continuous fiber-reinforced thermosetting resin-based composite material with high thermal conductivity. ADVANTAGE - The composite material: has excellent mechanical, heat-resistant and thermal conductivity properties, especially high out-of-plane thermal conductivity, and the composition, structure and properties can be adjusted arbitrarily, the preparation method is simple, the large-scale production is easy, and has broad application prospects. DETAILED DESCRIPTION - Preparing continuous fiber-reinforced thermosetting resin-based composite material having high thermal conductivity, comprises (1) uniformly dispersing epoxy prepolymer, curing agent, catalyst, thermally conductive filler and solvent to obtain mixed solution, impregnating continuous fibers, removing the solvent by heating and cooling to obtain solvent-based prepreg; or uniformly dispersing epoxy prepolymer, curing agent, catalyst and thermally conductive filler under heating conditions to prepare a film, and then impregnating the continuous fiber with the film and cooling to obtain hot-melt prepreg, where the epoxy prepolymer comprises at least one epoxy prepolymer with aromatic amide structure, the curing agent includes at least one curing agent having an aromatic amide structure, the epoxy prepolymer with aromatic amide structure is compound of formula (I) or (II) or their mixture, (2) hot-pressing the above-mentioned solvent method prepreg or hot melt method prepreg and solidifying to obtain final product. R1, R2 = aromatic amine compounds of formulae (1)-(25). An INDEPENDENT CLAIM is also included for continuous fiber-reinforced thermosetting resin-based composite material with high thermal conductivity, prepared by above method.