▎ 摘　　要

NOVELTY - Preparing ultra-thin soft solder modified layer on surface of graphene film comprises (i) processing the area to be modified on the graphene film, (ii) placing the active solder alloy above the to-be-modified area, and performing braze welding under vacuum condition to form a first modified layer, (iii) placing a metal sheet on the surface of the first modification layer, and performing micro-diffusion welding under the vacuum condition, and (iv) forming a second modified layer. USE - Preparation method of ultra-thin soft soldering modified layer of graphene film surface. Uses include but are not limited to flexible radio frequency antenna, flexible display screen, sensor and super capacitor electronic device. ADVANTAGE - The method can realize good mechanical occluding and metallurgical bonding between the graphene film and the soft soldering modified metal layer. The bonding strength between the modified layer and graphene film is high, interface contact thermal resistance and low resistance contact. The graphene film surface ultra-thin soft solder modified alloy layer has high stability, conductivity and radiating performance. The wettability between the conventional low-temperature solder is improved, thus obtaining better welding effect.