• 专利标题:   Preparing conductive sponge useful in field of pressure sensor comprises e.g. heating and dissolving elastic resin in solvent to obtain elastic resin carrier, mixing conductive filler with resin carrier, adding second solvent in mixed slurry, dipping sponge into conductive slurry, drying.
  • 专利号:   CN114262467-A
  • 发明人:   GAO F, HUANG L, HU Y, ZENG X, ZHOU H, ZHOU B
  • 专利权人:   FOSHAN RF IOT TECHNOLOGY CO LTD, GUANGDONG NANHAI QIMING GUANGDA TECHNOLO
  • 国际专利分类:   C08J009/40, C08K003/08, C08K009/12, C08L075/04, H01B013/00
  • 专利详细信息:   CN114262467-A 01 Apr 2022 C08J-009/40 202238 Chinese
  • 申请详细信息:   CN114262467-A CN11584624 22 Dec 2021
  • 优先权号:   CN11584624

▎ 摘  要

NOVELTY - Preparing conductive sponge comprises (1) heating and dissolving the elastic resin in the first solvent to obtain the elastic resin carrier, (2) mixing the conductive filler with the elastic resin carrier, where the mass ratio of the conductive filler and the elastic resin is 60- 80: 40-20, stirring and dispersing to grind to obtain the mixed slurry, (3) adding the second solvent in the mixed slurry, adjusting the viscosity of the mixed slurry to obtain the conductive slurry, (4) dipping the sponge into the conductive slurry, taking out and drying to obtain a conductive sponge, where the mass fraction of conductive sponge after drying is 20-50 wt.%. USE - The method is useful for preparing conductive sponge, which is useful in the field of pressure sensor. ADVANTAGE - The conductive sponge: has good softness and repeated compressibility; can adapt to repeated compression environments; is sensitive to compressive stress changes, and is suitable for use in pressure sensors for compression deformation, which solves the problem of existing problems. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a conductive sponge; and (2) a conductive sponge pressure sensor comprising a conductive sponge layer (1), where the lower surface of the conductive layer sponge adhered with an adhesive layer, the left and right respectively of the upper surface of the conductive layer sponge attached with a first conductive metal layer (3) and a second conductive metal layer (4), and the first conductive metal layer and the second conductive metal layer is respectively with a lead. DESCRIPTION OF DRAWING(S) - The drawing shows a top view structure schematic diagram of the conductive sponge sensor. Conductive sponge layer (1) First conductive metal layer (3) Second conductive metal layer (4) Lead (5) Lead nail (6)