▎ 摘　　要

NOVELTY - A heat-dissipating composition comprises a base resin, and boron nitride dispersed in the base resin. The boron nitride is surface-modified by pi - pi stacked benzoic acid, 50 wt.% large boron nitride (BNl) having a particle size of 8-15 mu m and small boron nitride (BNs) having a particle size of less than 0.5-8 mu m in weight ratio of 9:1-7:3. The composition has a thermal conductivity of 2.2 W/m.K or more and a tensile strength of 10 GPa. USE - Heat-dissipating composition used for forming polymer composite used in automobile component and electronic/mechanical component device. ADVANTAGE - The heat-dissipating composition provides polymer composite having improved thermal conductivity, tensile strength and hardness compared to low viscosity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of hydrophilic surface-modified boron nitride, which involves (1) preparing a dispersion by mixing benzoic acid and boron nitride, and (2) forming pi - pi stacking between the benzoic acid and boron nitride by pressurizing the dispersion.