• 专利标题:   Heat-dissipating composition used for forming polymer composite, comprises base resin, and boron nitride which is surface-modified by pi-pi stacked benzoic acid, large boron nitride and small boron nitride, and has preset thermal conductivity and tensile strength.
  • 专利号:   KR2291752-B1
  • 发明人:   LEE G, MIN K J
  • 专利权人:   KOREA BASIC SCI INST
  • 国际专利分类:   C08K009/04, C08K003/04, C08K003/38, C08L101/00, C08L063/00
  • 专利详细信息:   KR2291752-B1 24 Aug 2021 C08K-009/04 202176 Pages: 12
  • 申请详细信息:   KR2291752-B1 KR178903 18 Dec 2020
  • 优先权号:   KR178903

▎ 摘  要

NOVELTY - A heat-dissipating composition comprises a base resin, and boron nitride dispersed in the base resin. The boron nitride is surface-modified by pi - pi stacked benzoic acid, 50 wt.% large boron nitride (BNl) having a particle size of 8-15 mu m and small boron nitride (BNs) having a particle size of less than 0.5-8 mu m in weight ratio of 9:1-7:3. The composition has a thermal conductivity of 2.2 W/m.K or more and a tensile strength of 10 GPa. USE - Heat-dissipating composition used for forming polymer composite used in automobile component and electronic/mechanical component device. ADVANTAGE - The heat-dissipating composition provides polymer composite having improved thermal conductivity, tensile strength and hardness compared to low viscosity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of hydrophilic surface-modified boron nitride, which involves (1) preparing a dispersion by mixing benzoic acid and boron nitride, and (2) forming pi - pi stacking between the benzoic acid and boron nitride by pressurizing the dispersion.