▎ 摘　　要

NOVELTY - A heat dissipation buffer film is divided into release film layer, grid adhesive layer, foam buffer layer, graphene layer and metal foil layer from top to bottom. The preparation of graphene layer involves using uncleaned rolled metal as the substrate for chemical vapor deposition (CVD) of graphene, and grease as a carbon source for growing graphene on the metal surface, placing the uncleaned rolled metal directly into a CVD system for growth, and forming a graphene film on the surface of the rolled metal. The preparation of foam buffer layer involves directly coating a layer of acrylic crosslinking agent on the surface of the graphene layer, drying in an oven, and re-foaming the dried material in the oven. The preparation of grid adhesive layer and release film layer involves coating an acrylic adhesive on the textured release film, and drying in a six-section oven to obtain the grid adhesive layer, which is bonded to the foam buffer layer to form a heat dissipation buffer film. USE - Heat dissipation buffer film. ADVANTAGE - The film efficiently reduces the thermal resistance of the material, improves the heat dissipation performance of the material to effectively eliminates the interface thermal resistance, retains the thermal conductivity of graphite, and reduces the thickness of the graphite layer for thinning material and high thermal conductivity.