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  • 专利标题:   Conductive adhesive composition useful in organic light emitting diode device, comprises e.g. epoxy resin, phenolic resin, copper powder, graphene, curing agent, plasticizer, toughening agent, accelerator, and thickener.
  • 专利号:   CN108070336-A
  • 发明人:   QI Y
  • 专利权人:   SUZHOU JISAI ELECTRONIC TECHNOLOGY CO
  • 国际专利分类:   C09J011/04, C09J011/06, C09J161/06, C09J163/00, C09J009/02
  • 专利详细信息:   CN108070336-A 25 May 2018 C09J-163/00 201842 Pages: 4 Chinese
  • 申请详细信息:   CN108070336-A CN11376106 19 Dec 2017
  • 优先权号:   CN11376106

▎ 摘　　要

NOVELTY - Conductive adhesive composition comprises 50-100 pts. wt. epoxy resin, 10-25 pts. wt. phenolic resin, 75-150 pts. wt. copper powder, 5-15 pts. wt. graphene, 25-50 pts. wt. curing agent, 0.5-2 pts. wt. plasticizer, 1-2 pts. wt. toughening agent, 1-2 pts. wt. accelerator, 2-3 pts. wt. antioxidant MB (mercaptobenzimidazole) and 1-2 pts. wt. thickener. USE - The composition is useful in organic light emitting diode device (claimed). ADVANTAGE - The composition: has excellent electrical conductivity and chemical stability, and meet the requirements of various electronic product production process conditions.