▎ 摘　　要

NOVELTY - Preparation of graphene doped epoxy conductive adhesive involves preparing stable dispersion of colloidal graphene oxide by Hammers method, mixing colloidal graphene oxide and sodium citrate-silver complex, centrifugal washing by dissolving in dimethyl formamide solvent, preparing silver/graphene hybrid solution, adding epoxy resin, curing agent and accelerating agent, ultrasonic processing, casting, producing composite conductive adhesive tetrafluoroethylene mold, curing, heating, cooling, adjusting amount of epoxy resin and thickness and size of the mold size, and casting. USE - Preparation of graphene doped epoxy conductive adhesive used for electrical/electronic component. ADVANTAGE - The method enables reparation of graphene doped epoxy conductive adhesive having high conductivity and improved adhesiveness. DETAILED DESCRIPTION - Preparation of graphene doped epoxy conductive adhesive involves preparing stable dispersion of colloidal graphene oxide by Hammers method under normal temperature, mixing colloidal graphene oxide and sodium citrate-silver complex, magnetic stirring for 12-l5 hours, providing the graphene oxide sodium citrate at 80 degrees C for 6 hours, reducing to conductive graphene sheet, centrifugal washing by dissolving in dimethyl formamide solvent, preparing silver/graphene hybrid solution with concentration of 2 mg/ml, adding epoxy resin, grinding, mixing uniformly, adding curing agent and accelerating agent into a three-neck bottle in solution, adding silver nanowires modified graphene dopant solution, vacuum pumping under -0.05 MP until there is no air bubbles, ultrasonic processing, casting, producing composite conductive adhesive tetrafluoroethylene mold, curing under -0.1 MP at 80 degrees C, removing air bubbles, heating at 90 degrees C, 110 degrees C and 130 degrees C, for respectively for two hours, then cooling in air, sampling, adjusting amount of epoxy resin and thickness and size of the mold size, and casting.