• 专利标题:   Image sensor for converting optical image signal into electric signal, has heat spreading layer on first surface or second surface of first substrate and including synthetic diamond layer, graphene layer, or diamond-like carbon (DLC) layer.
  • 专利号:   US2017104019-A1, KR2017042940-A, CN107017270-A, US9985062-B2
  • 发明人:   JUNG Y, JUNG Y W, ZHENG R
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   H01L027/146, H01L023/373, H04N005/378
  • 专利详细信息:   US2017104019-A1 13 Apr 2017 H01L-027/146 201731 Pages: 39 English
  • 申请详细信息:   US2017104019-A1 US289316 10 Oct 2016
  • 优先权号:   KR142168

▎ 摘  要

NOVELTY - The image sensor (100) has a first substrate (110) with a first surface and a second surface. The first and second surfaces are opposite surfaces of the first substrate. The first substrate includes an active pixel sensor area. The active pixel sensor area includes a photoelectric conversion region. The sensor has a microlens (184) on first surface. A multilayered interconnection structure (128) is on second surface. A heat spreading layer (160) on the first surface or the second surface includes a synthetic diamond layer, a graphene layer, or a DLC layer. USE - Image sensor for converting optical image signal into electric signal. ADVANTAGE - An image sensor is provided by which a dark current is reduced, and uniform, excellent resolution is obtained in the entire active pixel sensor area. A sufficiently great and non-uniform dark current in the active pixel sensor area (APS) to result in dark shading on the APS is reduced and/or prevented from occurring in the active pixel sensor area adjacent to the source of generated heat and thus, the image sensor provides a uniform or uniform resolution. The image sensor provides an improved resolution based on the reduction and/or prevention of a sufficiently large and non-uniform dark current to induce dark shading on the APS. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of an image sensor. Image sensor (100) First substrate (110) Multilayered interconnection structure (128) Heat spreading layer (160) Microlens (184)