▎ 摘　　要

NOVELTY - The device has a heat dissipation mechanism fixed in a case. A first heat dissipation box is connected with a water tank, a water pump and a second heat dissipation box. An outer side part of the first dissipation box is formed with a groove that is provided with a heat conducting plate. A controller is installed on a computer main board and electrically connected with the pump. A heat conducting layer is formed by 86 weight parts of graphene, 5 weight parts of isocyanate resin, 7 weight parts of melamine resin, 14 weight parts of aluminum nitride and 0.2 weight parts of rare earth oxide. USE - Computer temperature control device. ADVANTAGE - The device is quick to dissipate heat, and has high heat dissipation performance and better heat conducting effect of the heat conducting plate. DESCRIPTION OF DRAWING(S) - The drawing shows a top perspective view of a computer temperature control device.