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  • 专利标题:   Insulating resin composition for multilayer wiring substrate, includes polymer resin, where oxidation graphene is dispersed in cured product of membranous polymer resin.
  • 专利号:   KR2012058127-A, JP2012117052-A
  • 发明人:   SHIM J H, LEE K S, JI S Y
  • 专利权人:   SAMSUNG ELECTROMECHANICS CO, SAMSUNG ELECTROMECHANICS CO
  • 国际专利分类:   H01B003/12, H01B003/40, H01L021/08, C08K003/04, C08L101/00, H05K001/03
  • 专利详细信息:   KR2012058127-A 07 Jun 2012 H01B-003/40 201242 Pages: 19
  • 申请详细信息:   KR2012058127-A KR119775 29 Nov 2010
  • 优先权号:   KR119775

▎ 摘　　要

NOVELTY - An insulating resin composition includes polymer resin, where oxidation graphene is dispersed in cured product of membranous polymer resin. USE - Insulating resin composition for use in multilayer wiring substrate (claimed). ADVANTAGE - The insulating resin composition provides multilayer wiring substrate with better mechanical strength. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a multilayer wiring substrate. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a multilayer wiring substrate.