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  • 专利标题:   Soldering tip for hard- and soft-soldering, comprises graphene layers in its structure.
  • 专利号:   DE102009052718-A1
  • 发明人:   DOBRICK C M
  • 专利权人:   DOBRICK C M
  • 国际专利分类:   B23K003/02
  • 专利详细信息:   DE102009052718-A1 09 Dec 2010 B23K-003/02 201082 Pages: 2 German
  • 申请详细信息:   DE102009052718-A1 DE10052718 03 Nov 2009
  • 优先权号:   DE10017828

▎ 摘　　要

NOVELTY - The soldering tip for hard- and soft-soldering, comprises graphene layers in its structure. USE - Soldering tip for hard- and soft-soldering, and useful in electronics and electrical engineering. ADVANTAGE - The soldering tip has improved thermal conductivity and good heat transmission, and enables desired accurate and fast temperature control.