▎ 摘　　要

NOVELTY - Manufacture of high heat-resistant ultra-low expansion polyimide film comprises (i) weighing aromatic diamine, 15-20 pts. wt. 2-(4 phenyl)-5-amino benzimidazole, 40-50 pts. wt. tetrachloro-40-dianhydride, 1-4 pts. wt. germanium titanate, 0.2-5 pts. wt. nano-silica, 0-3 pts. wt. nanofibril, and 1-3 pts. wt. titanium dioxide, and mixing with solvent to obtain resin acid solution, (ii) filtering the polyamic acid resin solution, vacuum defoaming, uniformly coating on the substrate of the surface to heating at 100-200℃, keeping the temperature to form resin film, peeling the substrate, (iii) fixing the periphery of the resin film on the frame of the metal mold, raising the temperature at 500℃ at a speed of 2-5℃/minute, annealing, naturally cooling to room temperature. USE - Method for manufacturing high heat-resistant ultra-low expansion polyimide film used for electronics, microelectronics , optical display or optical communication field (claimed). Can also be used as groove insulating and cable wrapping used for electric machine, flexible printing circuit board base material and high temperature resistant motor electric appliance insulating materials. ADVANTAGE - The method provides high heat-resistant ultra-low expansion polyimide film having low thermal expansion, low moisture absorption rate, high heat resistance and high toughness.