• 专利标题:   Heat-dissipating-type conductive silver paste used for bonding components used in e.g. electronics, comprises resin mixture, silver powder, and graphene, in preset mass ratio.
  • 专利号:   WO2018024073-A1, CN107686705-A
  • 发明人:   LIU R, SUI A, LI X
  • 专利权人:   KUANGCHI ADVANCED TECHNOLOGY INST
  • 国际专利分类:   C09J163/00, C09J163/02, C09J009/02, C09J011/04, C09J011/06
  • 专利详细信息:   WO2018024073-A1 08 Feb 2018 C09J-009/02 201813 Pages: 15 Chinese
  • 申请详细信息:   WO2018024073-A1 WOCN091978 06 Jul 2017
  • 优先权号:   CN10635712

▎ 摘  要

NOVELTY - A heat-dissipating-type conductive silver paste comprises 100 parts mass resin mixture, 100-500 parts mass silver powder, and 10-100 parts mass graphene. USE - Heat-dissipating-type conductive silver paste is used for bonding components used in electronics, information technology and electroplating industries. ADVANTAGE - The heat-dissipating-type conductive silver paste has high thermal conductivity and improved heat dissipation property. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of heat-dissipating-type conductive silver paste, which involves mixing a resin, a curing agent and a silane coupling agent in proportion to obtain the resin mixture, degassing the resin mixture, and mixing the resin mixture with silver powder and graphene.