▎ 摘　　要

NOVELTY - The system has a laser light source unit (100) and a control unit (500) that are provided for emitting laser light, and a laser energy and polarization adjustment unit (200), a beam focusing unit (300) and a three-dimensional mobile platform (400) are sequentially arranged along the emitting optical path (110) of the laser. The beam focusing unit is configured to focus the laser in a single direction to adjust a processing spot. A graphene oxide thin film sample is fixedly arranged on the three-dimensional mobile platform, and the laser is vertically irradiated on the surface of the graphene oxide thin film sample to complete the microstructural and reduction processing of the graphene oxide thin film sample. The control unit is provided in communication connection with the three-dimensional mobile platform and is used for controlling the movement of the graphene oxide thin film sample on the three-dimensional mobile platform. USE - System for laser processing of two-dimensional materials. ADVANTAGE - The reduction of the graphene oxide film and the rapid preparation of the surface microstructure are achieved by controlling the processing parameters of the laser. The simultaneous completion of micro-nano structure and reduction treatment of graphene oxide film are realized in a large area, so as work efficiency is improved. The synchronous implementation of the light reduction and surface microstructure preparation of the graphene oxide thin film can be completed, the incident laser energy and the pulse overlap number can be adjusted by changing the polarization direction of the incident laser, and the micro-structure morphology can be regulated and controlled. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for graphene oxide microstructure and reduction treatment. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the system for laser processing of two-dimensional materials. Laser light source unit (100) Emitting optical path (110) Laser energy and polarization adjustment unit (200) Beam focusing unit (300) Three-dimensional mobile platform (400) Control unit (500)