• 专利标题:   Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.
  • 专利号:   WO2021206775-A1, IN202041015525-A, US2023113973-A1
  • 发明人:   ANANDAKRISHNAN S, WU K
  • 专利权人:   HEWLETTPACKARD DEV CO, HEWLETTPACKARD DEV CO LP, HEWLETTPACKARD DEV CO LP
  • 国际专利分类:   C09D175/04, G06F001/20, G01N033/533, H05B031/00, B01J020/286, C02F003/28, B63C007/26, C09D005/00, C09D007/48, C09D007/61, C09D007/63
  • 专利详细信息:   WO2021206775-A1 14 Oct 2021 G06F-001/20 202187 Pages: 29 English
  • 申请详细信息:   WO2021206775-A1 WOUS012634 08 Jan 2021
  • 优先权号:   IN41015525, WOUS012634

▎ 摘  要

NOVELTY - Substrate (1) coated with a thermal management material for an electronic device, where the thermal management material comprises a thermal conductive coat (2) deposited on the substrate, and a heat insulation coat (3) deposited on the thermal conductive coat. The heat insulation coat comprises a plant root powder and a resin. USE - The substrate is useful in an electronic device comprising a computer, a laptop, a tablet, a cell phone, a portable networking device, a portable gaming device and a portable GPS (all claimed). ADVANTAGE - The substrate: improves the visual appearance; and is economical. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) coating a substrate with a thermal management material for an electronic device comprising applying a thermal conductive coating solution to the substrate, heating the substrate to form a thermal conductive coat deposited on the substrate, applying a heat insulation coating solution to the thermal conductive coat, where the heat insulation coating solution comprises a plant root powder and a resin, and heating the substrate to form a heat insulation coat deposited on the thermal conductive coat; and (2) an electronic device having a housing, where the housing comprises a substrate, a thermal conductive coat deposited on the substrate, and a heat insulation coat deposited on the thermal conductive coat, where the heat insulation coat comprises a plant root powder and a resin. DESCRIPTION OF DRAWING(S) - The figure shows a partial cross-sectional view of substrate coated with a thermal management material for an electronic device. Substrate (1) Thermal conductive coat (2) Heat insulation coat (3)