▎ 摘　　要

NOVELTY - Substrate (1) coated with a thermal management material for an electronic device, where the thermal management material comprises a thermal conductive coat (2) deposited on the substrate, and a heat insulation coat (3) deposited on the thermal conductive coat. The heat insulation coat comprises a plant root powder and a resin. USE - The substrate is useful in an electronic device comprising a computer, a laptop, a tablet, a cell phone, a portable networking device, a portable gaming device and a portable GPS (all claimed). ADVANTAGE - The substrate: improves the visual appearance; and is economical. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) coating a substrate with a thermal management material for an electronic device comprising applying a thermal conductive coating solution to the substrate, heating the substrate to form a thermal conductive coat deposited on the substrate, applying a heat insulation coating solution to the thermal conductive coat, where the heat insulation coating solution comprises a plant root powder and a resin, and heating the substrate to form a heat insulation coat deposited on the thermal conductive coat; and (2) an electronic device having a housing, where the housing comprises a substrate, a thermal conductive coat deposited on the substrate, and a heat insulation coat deposited on the thermal conductive coat, where the heat insulation coat comprises a plant root powder and a resin. DESCRIPTION OF DRAWING(S) - The figure shows a partial cross-sectional view of substrate coated with a thermal management material for an electronic device. Substrate (1) Thermal conductive coat (2) Heat insulation coat (3)