▎ 摘　　要

NOVELTY - The assembly (100) has a semiconductor substrate disposed over another semiconductor package along a vertical direction. A layer of thermally conductive material is disposed between the semiconductor packages. The layer thermally conducts heat outward in a lateral direction perpendicular to the vertical direction from between the package and the package. The layer is directly in contact with the back side and front side of the package, and isolated from conductive interconnects disposed between and electrically connecting the two package, and the substrate. The material comprises graphene, graphite, and/or carbon nanotubes. USE - Semiconductor device assembly. ADVANTAGE - The method enables providing the semiconductor device assembly with improved thermal performance in an efficient manner. The method allows the heat dissipating structures such as lids or heat sinks to be provided over semiconductor dies to assist with heat exchange between the package and an environment in which the package is operated. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for making a semiconductor device assembly. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a semiconductor device assembly. Semiconductor device assembly (100) Package substrate (101) Semiconductor die (102) Solder balls (104) Film (106)