• 专利标题:   Method for pre-processing circuit board heat dissipation ink comprises pouring heat-curable graphene ink and antifoaming agent into stirring tank in ratio, shearing and stirring ink in stirring tank, and using bilateral sawtooth.
  • 专利号:   CN110917982-A, CN211636355-U
  • 发明人:   CAI S, YU P, WANG R, LIU C, ZHANG H, ZENG X, CHEN J
  • 专利权人:   ZHUHAI DOUMEN MULTEK IND CO LTD
  • 国际专利分类:   B01D019/04, B01F015/00, B01F007/18, B01F007/26
  • 专利详细信息:   CN110917982-A 27 Mar 2020 B01F-015/00 202033 Pages: 7 Chinese
  • 申请详细信息:   CN110917982-A CN11336777 23 Dec 2019
  • 优先权号:   CN11336777, CN22330134

▎ 摘  要

NOVELTY - The method comprises (S1) pouring the heat-curable graphene ink and antifoaming agent into the stirring tank in ratio, (S2) shearing and stirring the ink in the stirring tank under the condition of rotating speed greater than or equal to 1000 revolutions/minute and stirring time greater than or equal to 10 minutes, using bilateral sawtooth dispersion for shear stirring, performing the stirring under non-vacuum condition, and (S3) cooling the stirred ink to room temperature, where the ratio of the antifoaming agent in step (S1) is to add 3-5 ml of antifoaming agent to 1 kg of ink. USE - Method for pre-processing of circuit board heat dissipation ink. ADVANTAGE - The method: helps eliminate air bubbles in the ink; can make graphene evenly distribute in the ink; and reduces production cost. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a device for pre-processing of circuit board heat dissipation ink. DESCRIPTION OF DRAWING(S) - The drawing shows a flow diagram illustrating the method for pre-processing of circuit board heat dissipation ink (Drawing includes non-English language text).