▎ 摘　　要

NOVELTY - Preparing silicon dioxide filling type epoxy resin copper-clad plate comprises (a) vacuum-drying a nano- silicon dioxide powder, mixing with γ-aminopropyltriethoxysilane and adding to xylene, stirring and heating for reaction, washing and drying, (b) adding modified silicon dioxide and an oxidized graphene into an ethanol solution, mechanically stirring, filtering, drying, sieving, (c) taking oxidized graphene- silicon dioxide composite material and dispersing in deionized water, adding sodium hydroxide solution to adjust the pH to 9-10, adding hydrazine hydrate, stirring, continuously stirring and reacting, filtering, washing, drying, (d) heating the bisphenol A epoxy resin, adding curing agent, acetone, flame retardant, and reduced oxidized graphene- silicon dioxide composite material, mixing uniformly, coating the resin glue solution on a glass fiber cloth, drying, covering a copper foil on resin glue solution, hot pressing and curing to obtain the epoxy resin copper clad plate. USE - The method is useful for preparing silicon dioxide filling type epoxy resin copper-clad plate. ADVANTAGE - The plate has high dielectric strength and excellent chemical stability; improves the light stability, heat resistance and chemical stability of the material, and improves the heat resistance and antistatic property of epoxy resin, and has toughening modification effect. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an epoxy resin copper-clad plate, which is prepared by above method.