• 专利标题:   Preparing thermally conductive filler involves mixing graphene dispersion, dopamine and tris buffer solution for surface treatment to obtain modified graphene, mixing modified graphene with inert solvent.
  • 专利号:   CN112210120-A, CN112210120-B
  • 发明人:   MU J, HE Q, LI S, CHEN R, WANG Z, WEN F
  • 专利权人:   UNIV JILIN
  • 国际专利分类:   C08K003/04, C08K009/02, C08K009/04, C08L081/06
  • 专利详细信息:   CN112210120-A 12 Jan 2021 C08K-009/04 202121 Pages: 10 Chinese
  • 申请详细信息:   CN112210120-A CN11078811 10 Oct 2020
  • 优先权号:   CN11078811

▎ 摘  要

NOVELTY - Preparing thermally conductive filler involves mixing graphene dispersion, dopamine and tris buffer solution for surface treatment to obtain modified graphene, mixing the modified graphene with an inert solvent to obtain a modified graphene dispersion, oxidizing the carbon nanotubes with concentrated nitric acid to obtain modified carbon nanotubes, mixing the modified carbon nanotubes with an inert solvent to obtain a modified carbon nanotube dispersion. The modified carbon nanotube dispersion is dropped into the modified graphene dispersion and then dried to obtain the thermally conductive filler. USE - Method for preparing thermally conductive filler. ADVANTAGE - The method enables to prepare thermally conductive filler which make the two types of fillers self-assemble due to the functional groups on the surface through the action of hydrogen bonds. The modified carbon nanotube overlaps the modified graphene sheet to increase the effective contact area and achieves the purpose of adding a small amount of heat conductive filler to significantly improve the thermal conductivity of the composite material. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for following: (1) a thermally conductive filler, which comprises a modified carbon nanotube and a modified graphene, the modified graphene is a carrier, and the modified carbon nanotube is overlapped on the sheet of the modified graphene; (2) a poly (arylene ether sulfone) heat conductingcomposite material, which comprises heat conducting filler 5 to 25 % and75 to 95 % of polysulfone substrate, where polysulfone substratecomprises one or more of polymethylene sulfone,polyether sulfone and bisphenol A type polysulfone; and (3) a method for preparing poly (aryleneether sulfone) heat conducting composite material, which involves dispersing the heat-conducting fillerin the organic solvent, mixing with the polysulfonesubstrate and drying to obtain the polyaryl ethersulfone heat-conducting composite material.