▎ 摘　　要

NOVELTY - Flexible heating device comprises flexible heating pad, which has flexible substrate layer and an electroconductive heat module formed over the flexible substrate layer, comprises a first electrode, a second electrode, a flexible heat generating layer, a conductivity layer and a lateral heat transferring layer. The first and second electrodes being apart from each other. The flexible heat generating layer interposed and electrically connecting between the first and second electrodes. The flexible heat generating layer is made of an electrically conductive material having a surface resistance sufficient to generate two-dimensional electroconductive heating when an electric current flows between the first and second electrodes. The flexible heat generating layer comprises a number of perforations formed through a thickness thereof and distributed generally throughout a two-dimensional area of the flexible heat generating layer. USE - Flexible heating device used in textile articles, garments, wearable devices, household goods and products, automobiles, outdoor and sports equipment. ADVANTAGE - The flexible heating device is flexible, bendable, foldable, and water-washable. The flexible heat generating layer has a thickness in a range of 1-200 μm, 10-100 μm, or 40-80 μm. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: A garment, comprises a garment body and the flexible heating device, where the flexible heating device is attached to a surface of the garment body. A method for making the flexible heating device, which involves: providing a film of the electrically conductive material, printing a metal paste on a surface of the film to form a conductive layer, forming perforations through the thickness of the film and the printed conductive layer to provide a perforated flexible heat generating layer, electrically connecting the perforated flexible heat generating layer to the first and second electrodes such that the first and second electrodes are apart from each other with the distance, which provides an intermediate device, laminating the intermediate device with the lateral heat transfer layer to provide the electroconductive heat module, and placing the electroconductive heat module over the flexible substrate layer.